Description

The LANCER BLADE adopts a low-profile heatsink design, removing height consideration from heatsink assembly, and making the product suitable for installation in small chassis. The heatsink is decorated in simple geometric lines, which are a versatile look when paired with
various chassis types. The LANCER BLADE has undergone strict component selection and screening procedures, and passed reliability and compatibility tests. It is strong and durable, offering the highest quality! The LANCER BLADE supports AMD EXPO and is compatible with
the latest AMD platform. It also supports Intel XMP 3.0 overclocking, providing players with excellent overclocking performance.

Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.

Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It’s lower operating voltage also make LANCER more power-efficient than DDR4.

Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.

Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.

AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.

Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.

Features
? Compact Low-Profile Heatsink Design
? PMIC for power supply stability
? On-die ECC error correction
? High-quality materials for stable overclocking
? Works with the Latest AMD Platforms
? Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking

Technical Specifications

Model:
AX5U5600C4616G-SLABBK

Type:
DDR5

Capacity:
16GB (1x16GB)

Speed:
5600MHz

CAS Latency:
CL46 (46-45-45)

Voltage:
1.15V

Form Factor:
DIMM

Pin Count:
288-Pin

ECC:
Non-ECC

Buffering:
Unbuffered

Heat Spreader:
Yes, designed for enhanced heat dissipation and stability

Compatibility:
Rigorously tested for compatibility with a variety of systems, ensuring seamless integration and optimal performance

Certifications:
RoHS

RGB
No

Warranty:
Manufacturer’s Limited Lifetime Warranty